PIC Assembly Laser Cleaning Solution
Powered by the World’s First High Peak Power 3 µm Fiber Laser
Meet Femtum at Photonics West 2026 in San Francisco Booth #5317
In collaboration with
NEW PRoduct
Photonics Wafer Laser Trimming Solution
From Waste to Yield. Instantly.
At Femtum, we enable the making of AI semiconductor chips with the power of unique 3 µm fiber lasers
Femtum is born from a strong desire to unleash the potential of mid-infrared lasers all over the world. Our mission is to help AI semicon manufacturers to solve their manufacturing bottlenecks by providing innovative advanced laser solutions.
Our Investors
NEW PRODUCT
Photonics Wafer Laser Trimming Solution
Key enabling techology for the PIC industry. From Waste to Yield. Instantly.
NEW PRODUCT
Photonics Assembly Laser Cleaning Solution
High-precision laser cleaning powered by the only 3 µm pulsed fiber lasers
Microprocessing Applications
Discover the power of mid-IR selective laser processing using Femtum fiber lasers
Our Products
Femtum offers a range of fiber laser products including ultrafast lasers, ns lasers, tunable lasers and amplifiers.
Knowledge & Support
How Laser Cleaning Is Solving a Hidden Manufacturing Challenge in Silicon Photonics
Building a photonic integrated circuit is a long journey. From wafer fabrication and dicing to assembly, packaging, and testing, a device passes through dozens of manufacturing steps before it reaches its final application. Every one of those steps introduces opportunities for contamination.
Meet us at Photonics North 2026
Femtum will be exhibiting at Photonics North 2026 in Quebec City from June 02 to June 05. Join us to discuss how our fiber laser solution enables more precise, selective, and fab-ready solutions for advanced photonics and semiconductor manufacturing. Visit us at Photonics North Booth #10.
Femtum Closes $16M Oversubscribed Series A to Scale Laser Solutions for Advanced Semiconductor Manufacturing
Quebec City, Canada — March 12, 2026 — Femtum, a developer of advanced fiber laser solutions for the manufacturing of silicon photonics, co-packaged optics and next-generation semiconductor devices, announced today the closing of a $16 million Series A financing round. The funding will support the company’s international expansion, accelerate adoption of its laser technologies among…
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